IEEE International Conference on Network Softwarization
28 June–2 July 2021 // Virtual Conference

Technical Program Committee

TPC Co-Chairs

  • Christian Esteve Rothenberg, University of Campinas – UNICAMP, Brazil
  • Barbara Martini, CNIT, Italy
  • Eiji Oki, Kyoto University, Japan

TPC Member

  • Rui Aguiar, University of Aveiro, Portugal
  • Nabeel Akhtar, Boston University, USA
  • Hyame Alameddine, University of Waterloo, Canada
  • Laurent Andrey, Loria, France
  • Gianni Antichi, Queen Mary University of London, UK
  • Hirochika Asai, Preferred Networks, Inc., Japan
  • Remi Badonnel, TELECOM Nancy – LORIA/INRIA, France
  • Luiz Bittencourt, University of Campinas, Brazil
  • Andreas Blenk, Technische Universität München, Germany
  • Mohamed Boucadair, Orange Labs, France
  • Olivier Brun, Laboratoire d’Analyse et d’Architecture des Systèmes, France
  • Marcus Brunner, Huawei, Switzerland
  • Oscar Mauricio Caicedo Rendon, University of Cauca, Colombia
  • Prasad Calyam, University of Missouri-Columbia, USA
  • Walter Cerroni, University of Bologna, Italy
  • Bruno Chatras, Orange Labs, France
  • Prosper Chemouil, Cnam, France
  • Shihabur Chowdhury, University of Waterloo, Canada
  • Stuart Clayman, University College London (UCL), UK
  • Alexander Clemm, Futurewei Technologies, USA
  • Didier Colle, IMEC – Ghent University, Belgium
  • Weverton Cordeiro, Federal University of Rio Grande do Sul, Brazil
  • Estefania Coronado, Fundació i2CAT, Internet i Innovació Digital a Catalunya, Italy
  • Thierry Coupaye, Orange Labs, France
  • Noel Crespi, Institut Mines-Télécom, Télécom SudParis, France
  • Filip De Turck, Ghent University – imec, Belgium
  • Panagiotis Demestichas, University of Piraeus, Greece
  • Mario Di Mauro, University of Salerno, Italy
  • Guillaume Doyen, Troyes University of Technology, France
  • Flavio Esposito, Saint Louis University, USA
  • Olivier Festor, INRIA Nancy – Grand Est, France
  • Jérôme François, INRIA Nancy Grand Est, France
  • Valerio Frascolla, Intel Deutschland Gmbh, Germany
  • Carol Fung, Virginia Commonwealth University, USA
  • Alex Galis, University College London (UCL), UK
  • Molka Gharbaoui, Scuola Superiore Sant’Anna, Italy
  • Roch Glitho, Concordia University, Canada
  • Pedro Henrique Gomes, Ericsson Research, Brazil
  • Lisandro Granville, Federal University of Rio Grande do Sul, Brazil
  • Carlo Augusto Grazia, University of Modena and Reggio Emilia, Italy
  • Israat Haque, Dalhousie University, Canada
  • Hiroaki Harai, National Institute of Information and Communications Technology, Japan
  • Davit Harutyunyan, Fondazione Bruno Kessler, Italy
  • David Hausheer, OVGU Magdeburg, Germany
  • Fujun He, Kyoto University, Japan
  • Takahiro Hirayama, National Institute of Information and Communications Technology, Japan
  • Daisuke Hisano, Osaka University, Japan
  • Oliver Hohlfeld, Brandenburg University of Technology, Germany
  • James Hong, POSTECH, Korea
  • Larry Horner, Intel, USA
  • Jinho Hwang, IBM Research, USA
  • Vatche Ishakian, Bentley University, USA
  • Christian Jacquenet, Orange Labs, France
  • Wolfgang John, Ericsson Research, Sweden
  • Shohei Kamamura, NTT, Japan
  • Noriaki Kamiyama, Ritsumeikan University, Japan
  • Joon-Myung Kang, Google, USA
  • Holger Karl, Paderborn University, Germany
  • Andreas J. Kassler, Karlstad University, Sweden
  • Kotaro Kataoka, Indian Institute of Technology Hyderabad, India
  • Eiji Kawai, National Institute of Information and Communications Technology, Japan
  • Ryota Kawashima, Nagoya Institute of Technology, Japan
  • Wolfgang Kellerer, Technische Universität München, Germany
  • Young-Tak Kim, Yeungnam University, Korea
  • Tatsuaki Kimura, Osaka University, Japan
  • Kazuhiko Kinoshita, Tokushima University, Japan
  • Yoshiaki Kiriha, Japan Science and Technology Agency, Japan
  • Nattapong Kitsuwan, The University of Electro-Communications, Japan
  • Tomohiro Korikawa, NTT, Japan
  • Slawomir Kuklinski, Orange Polska, Poland
  • Abdelkader Lahmadi, University of Lorraine, France
  • Sándor Laki, Eötvös Loránd University, Hungary
  • Sanghwan Lee, Kookmin University, Korea
  • Laurent Lefevre, Inria, France
  • Jeremie Leguay, Huawei Technologies, France Research Center, France
  • Aris Leivadeas, École de Technologie Supérieure, Canada
  • Noura Limam, University of Waterloo, Canada
  • Diego Lopez, Telefonica I+D, Spain
  • Hanan Lutfiyya, University of Western Ontario, Canada
  • Antonio Manzalini, Telecom Italia, Italy
  • Pedro Martinez-Julia, National Institute of Information and Communications Technology, Japan
  • Samir Medjiah, LAAS-CNRS, France
  • Catalin Meirosu, Ericsson, Sweden
  • Michael Menth, University of Tuebingen, Germany
  • Hiroki Nakayama, Bosco Technologies Inc., Japan
  • Yu Nakayama, Tokyo University of Agriculture and Technology, Japan
  • Masaki Ogura, Osaka University, Japan
  • Satoshi Ohzahata, The University of Electro-Communications, Japan
  • Haruo Oishi, NTT, Japan
  • Sangheon Pack, Korea University, Korea
  • Federica Paganelli, University of Pisa, Italy
  • Rafael Pasquini, Federal University of Uberlândia – UFU, Brazil
  • Jason Quinlan, University College Cork, Ireland
  • Danny Raz, Nokia and Technion, Israel
  • Roberto Riggio, i2CAT Fundation, Spain
  • Fulvio Risso, Politecnico di Torino, Italy
  • Elisa Rojas, University of Alcala, Spain
  • Javier Rubio-Loyola, CINVESTAV, Mexico
  • Stefano Salsano, University of Rome Tor Vergata, Italy
  • Carlos Raniery Santos, Federal University of Santa Maria, Brazil
  • Mateus Santos, Ericsson Research, Brazil
  • Takehiro Sato, Kyoto University, Japan
  • Alberto Schaeffer-Filho, Federal University of Rio Grande do Sul (UFRGS), Brazil
  • Giovanni Schembra, University of Catania, Italy
  • Sandra Scott-Hayward, Queen’s University Belfast, UK
  • Stefano Secci, Cnam, France
  • Motoyoshi Sekiya, Fujitsu Laboratories Limited, Japan
  • Joan Serrat, Universitat Politècnica de Catalunya, Spain
  • Saburo Seto, NTT, Japan
  • Hideyuki Shimonishi, NEC, Japan
  • Kohei Shiomoto, Tokyo City University, Japan
  • Flavio Silva, Federal University of Uberlândia, Brazil
  • Krishna Sivalingam, Indian Institute of Technology Madras, India
  • Sejun Song, University of Missouri Kansas City, USA
  • Burkhard Stiller, University of Zürich, Switzerland
  • Ranganath Sunku, Intel Corporaton, USA
  • Takuji Tachibana, University of Fukui, Japan
  • Yuzo Taenaka, Nara Institute of Science and Technology, Japan
  • Wouter Tavernier, Ghent University – imec, Belgium
  • Sujata Tibrewala, Intel, USA
  • Maria Torres Vega, Ghent University, Belgium
  • Mauro Tortonesi, University of Ferrara, Italy
  • Kazuya Tsukamoto, Kyushu Institute of Technology, Japan
  • Masato Tsuru, Kyushu Institute of Technology, Japan
  • Daphne Tuncer, Imperial College London, UK
  • Kurt Tutschku, Blekinge Institute of Technology, Sweden
  • Jeroen van der Hooft, Ghent University – imec, Belgium
  • Fábio Verdi, Federal University of São Carlos, Brazil
  • Raphael Vicente Rosa, Unicamp, Brazil
  • Yuefeng Wang, Akamai Technologies, Inc, USA
  • Tim Wauters, Ghent University – imec, Belgium
  • George Xilouris, NCSR Demokritos, Greece
  • Kaiping Xue, University of Science and Technology of China, China
  • Jiahai Yang, Tsinghua University, China
  • Tianzhu Zhang, Nokia Bell Labs, France
  • Mohamed Faten Zhani, École de Technologie Supérieure (ÉTS Montreal), Canada
  • Zuqing Zhu, University of Science and Technology of China, China
  • Thomas Zinner, NTNU, Norway

2021 Patrons


  • Platinum

  • ITOCHU Techno-Solutions Corporation logo

    Bronze

  • Hitachi logo

    Bronze

  • NEC logo

    Bronze


  • Bronze

Technical Co-Sponsors